Chosen Solution
Hi, After I reballed by iPhone 6s nand ic using stencil, I broke one pad(3rd row from top). Can someone tell me whether that pad matters or not? You can see the photo: Front Image and Back Image(IC flipped towards left )
Here is the NAND IC diagram from REWA technology:
Can you please compare the IC pads with those in the image to confirm whether it’s okay to proceed with this IC. Thanks
That’s a ground pin, it should be fine even without it.
